Underfill Training Reportunderfill.net/wp-content/uploads/2016/03/Underfill...4.Underfill Epoxy 4.1 Epoxy datasheet (Namics U8437-2) ITEM UNIT U8437-2 Filler content wt% 55 Density - [PDF Document] (2024)

Underfill Training Report

ContentFlip Chip Technology

Underfill Process

Underfill Machine

Underfill Epoxy

Underfill Failure Mode Analysis

Applied Component and Foreground of Underfill

1.Flip Chip Technology

Component

Substrate

P r o c e s s

An IntegratedTechnology!

It is a chip connection technology which interconnects an IC chip to its next level

of packaging in such manner that IC’s active side faces to substrate.

DIE

Substrate

Bump

Adhesive

1.1 What is flip chip

1.Flip Chip Technology

Shrinking electronic devices

Packaged IC

Chip-On-Board

Flip Chip / CSP

Flip Chip bump configuration

DIE

Substrate

EutecticUBMPassivation

final pad

1.2 The component-Flip chip

1.Flip Chip Technology

Coverlayer /Base Layer

Lamination Adhesive 1Copper Trace Lamination Adhesive 2Stiffener (Metal/Polyimide)

Dynamic Area

Rigid Area Rigid Area

Pad cross-section

Flex structure

1.3 Flex lamination layer(Cross section)

XX--RayRay

CC--SAM SAM (C-mode Scanning

Acoustic Microscopy)

Curing

Cleaning

Reflow

Final QC

Solder PrintingPre-baking Chip Mounting Bonding

Function Test

Underfill

1.4 Process Flow

1.Flip Chip Technology

1.5 Why Underfill ?

Significance:

• Reduce stress due to thermal expansion

• Increase lifetime of connections

• Protect connections mechanically

• Reduce chance of contamination

Underfill is required to encapsulate under the die to neutralize the effects of

CTE mismatch.

1.Flip Chip Technology

CTE mismatch of varies components in Flip Chip package will cause high stress at the interconnection.

Underfill reduce Stress by distributing such stress over the entire chip area so the stress will not concentrated at the interconnections.

1.Flip Chip Technology

1.5 Why Underfill ?

2.1 Relative process flow of underfill

Reflow Reflow Inspection Pre-heater(In underfill machine)

Cen-heater(In underfill machine)

Post-heater(In underfill machine)

Touch up

Curing

Process control point: Underfill pattern Epoxy temperature

Substrate temperature Curing condition

1.Underfill Technology

2.2 Control point in underfill processUnderfill pattern selection

2.Underfill Technology

2.2 Control point in underfill processEpoxy temperature when dispensing

We select low viscosity temperature to insure epoxy can be dispensed out fluently

and flow fast.

Temp

Viscosity

Temp 1 Temp 2

Epoxy’s viscosity profile

2.Underfill Technology

2.2 Control point in underfill processSubstrate temperature when underfill

Dispensing temperature control is let the temperature stable when the pallet in Cen-

heater(Temp 3 to Temp 5).

Temp

Time

Reflow

Reflow Insp

Pre-heaterCen-heater

60sec 30sec 40sec

140℃

95℃

110℃

Temp 1

Temp 2

Temp 3 Temp 4 Temp 5

. . . .

. Desired Temperature Profile When Underfill

2.Underfill Technology

2.2 Control point in underfill process

Curing condition

120 150 170 2005% 1.1 0.1 0.0 0.050% 14.5 1.1 0.2 0.090% 18.1 3.6 0.8 0.199% 96.1 7.2 1.6 0.2

99.9% 144.2 10.8 2.3 0.399.99% 192.2 14.4 3.1 0.499.999% 240.3 18.0 3.9 0.5

Temperature(oC)Reaction rate（％）

Namics U8437-2 epoxy

Time of reaction rate X% at each temperature （min.）

Insure the reaction rate surpass 99.99% is our control specification.

2.Underfill Technology

2.3 Process control in different underfill epoxy

Epoxy Temp Substrate Temp Curing Condition

Namics U8433L 55~65C 95+5C 65C/15mins+150C/60mins

Namics U8437-2 50~60C 85+10C 150C/60mins

Hysol FP4530 55~65C 85+10C 165C/15mins

Hysol FP4549 / 85+10C 165C/30mins

Emerson E-1159 30C 50+10C 120C/30mins or 130/15mins

ItemEpoxy

2.Underfill Technology

3.Underfill Machine

3.1 Develop history of dispense valveAir pressure time control

Now we use this for manual underfill

Ideal for use in low cost assembly areas

Very little maintenanceLow cost

Dispensed volume changes dependingon the fill level of the syringe

3.Underfill Machine

3.1 Develop history of dispense valveAuger pump

•Easy to Clean

•Used for small dots dispensing of silver / solder paste and encapsulants

•Accuracy 3 to 5 % typical in the 10 to 100mg range

DV-8K

3.Underfill Machine

3.1 Develop history of dispense valve

Linear pump(DP-3K)

3.Underfill Machine

3.1 Develop history of dispense valve

Dispense Jets

Dispenses adhesive material from a distance of 0.5 mm to 3 mm

Eliminates movement on the Z-axis between dots

Jet dispenser cycles every 10 ms ( 360,000 cycle/h )

DJ-2K

Standard Dove Tail Adapter

Integrated Temperature Control

Piston Stroke Adjust

MaterialFeed Tube

Nozzle/Seat Assembly

3.Underfill Machine

3.2 DJ-9K instruction

3.Underfill Machine

3.2 DJ-9K instruction

Needle

U-cup

Fluid chamber

O-Ring

Seat

Nozzle

TCA

Stroke adjustment knob

Spring

Load button

Needle

NozzleDispense Distance

Dispense Gap

3.Underfill Machine

3.2 DJ-9K instruction

a. Seat:15mil

b. Nozzle:6mil

b. Stroke length:15unit

c. Valve1 fluid air digital gauge: 15psi

d. Valve on/off time: 4/4msec

e. Needle heater temperature: 60C

f. Substrate temperature: 90~100(setting:135)

h. Dispensing gap: 55~75mil

i. Dispensing distance: 8~10mil

Parameter setting on Toshiba FPCA

M-620 X-1020

Dispensing Jet

Display

Power

Urgency Switch

3.Underfill Machine

3.3 Structure of Asymtek underfill machine: M-620 and X-1020

3.Underfill Machine

3.4 X-1020 machine

Vision / Lighting

Heating

Height Sense

Software

MFC &

CPJ

Algorithm 2_Multishot X_0712_X&Y Errors

-8-7-6-5-4-3-2-10123456789

-8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8

X Errors (mils)

Y Er

rors

(mils

)

Motion Control

Help File

3.Underfill Machine

3.4 X-1020 machine

1.Teach fiducial mark in workpiece to establish all sample’s location (Two circular

metal point on pallet);

2.Create pattern and teach fiducial mark on samples;

3.Edit weight control line in pattern,this will establish underfill pattern,epoxy

volume,dispensing gap,dispensing distance and other parameter;

4.Edit how the program running and teach each sample’s location.

How to edit a program

For optimal Production, a Program should contain three elements:

1.A Program File (dispensing commands, process commands, etc.)

2.A Fluid File (contains all relative parameters like dispense gap,dispense

speed to each dot.)

3.A Vision File (saved automatically when teaching a program)

4.A Recipe File (above three elements, when saved and assembled, are

collectively called a Recipe.)

How to save a program

3.Underfill Machine

3.4 X-1020 machine

FKV 2A0-U-9K-M-H-01 Program

3.Underfill Machine

3.4 X-1020 machine

FKV 2A0-U-9K-M-H-01 Program

3.Underfill Machine

3.4 X-1020 machine

4.Underfill Epoxy

4.1 Epoxy datasheet (Namics U8437-2)ITEM UNIT U8437-2

Filler content wt% 55Density - 1.6Colour - Black

Viscosity Pa.s 40Gel time(150C) sec 40

Tg(TMA) C 137C.T.E(TMA) <Tg 32

>Tg 100Bending modulus Gpa 8.0Bending strength Mpa 130Young's modulus Gpa 7.0

Poisson ratio - 0.33Volume resistivity Initial >1.0X1015

(500V) after PCT >1.0X1013Moisture obsorption (after PCT) wt% 1.4

Dielectric constant (1MHz) - 3.5Dielectric loss tangent (1MHz) - 0.007 (0.7%)

Thermal conductivity W/m.K 0.67 Purity (after PCT) Cl 2

Na <1.0K <1.0

Alpha ray emision cont/cm2.hr <.001PCT: 121C 2atm 20hours

ppm/C

ohm.cm

ppm

4.Underfill Epoxy

HOW TO USE Standard dispensing condition Needle :18-23G Temperature : Curing condition :150Cx20min(Standard) :165Cx60min(High reliability temperature reflow) Storage condition :Below -20C For a 10CC syringe,over 1 hours is needed for the syringe to return to room temperature

POT-LIFE Double Viscosity at 25C:>72hours

ADHESION STRENGTH(2x2mm chip) Shear strength:30kgf (Si Chip vs FR-4)

FLUIDITY TEST Test condition Substrate :FR-4 Chip :Glass Gap :50um Temperature :70C

0 1 2 3 4 50 5.5 11 14.5 16.5 19

5

10

15

20

25

0 2 4 6 8

Time(min.)

Fluid Length(mm)

4.Underfill Epoxy

4.2 Property of process control

Viscosity

Epoxy’s viscosity affect the dispense method and machine parameter.

FP4530 epoxy viscosity chart

2000

4000

6000

8000

0 50 100 150 200 250 300 350 400Time(mins)

Visc

osity

(cps

)

Double viscosity time(Epoxy’s use life)

52# Spindle 50rpm at 30C

4.Underfill Epoxy

4.2 Epoxy property on process control

Gel time

Epoxy’s gel time is the time of epoxy from liquid to gel,underfill flow time

should short than gel time.

Moisture absorption

Moisture absorption is the ability of epoxy absorb moisture,low moisture

absorption is good because more moisture in epoxy can cause epoxy can’t

be cured completely.

Curing schedule

Curing is made epoxy’s molecular structure from chain to net,after this,epoxy

become harden and firmed

4.2 Epoxy property on function

4.Underfill Epoxy

Filler content

Affect epoxy’s CTE,viscosity and bending strength

Tg

Epoxy’s glass transition temperature,high Tg avoid high temperature cause

defect because after the epoxy changed into glass state,its molecular distance

become big,it will cause CTE changed acutely and the epoxy become breakable.

C.T.E.

Underfill epoxy is filled to reduce the C.T.E mismatch of chip and FPC,so the

epoxy’s CTE should near to chip and substrate’s C.T.E.

4.2 Epoxy property on function

4.Underfill Epoxy

Bending strength

Bending strength

TempTg

Bending strength is the combine intensity between chip and FPC,it changed acutely when

the temperature achieved to epoxy’s Tg point.

4.2 Epoxy property on functionBending strength

4.Underfill Epoxy

LCD monitor

Force GaugeCamera

FPC Fixture

Console

Shear tester is used to test bending strength,shear knife go ahead with a

constant speed,if the epoxy was separate from FPC,the shear knife will stop and

a value will be showed on force gauge.

4.2 Epoxy property on functionThermal conductivityThermal conductivity is epoxy’s capability to transfer heat,to the hard disk driver,

high thermal conductivity epoxy is acceptable.

4.Underfill Epoxy

Volume resistivity

A concept in electrostatic,it shows material’s electric conduct capability.

Dielectric constant

A coefficient which express material’s insulating capability.To underfill epoxy,

the high dielectric constant value,the better to use.

4.Underfill Epoxy

4.4 Ideal epoxy in underfill process

High Tg/Low CTE/Low Modulus

Low stress,Improve thermal shock,temp cycle

+ Good adhesion to all different surfaces

High bonding strength

+ High Moisture Resistance

+ Fast flow

Productivity

+ Fast cure

Productivity

4.Underfill Epoxy

+ Low Shrinkage

Low warpage

+ Low pot life

Stable in process

+ No Void

Dispensability

+ No filler separation

Uniform flow

+ No toxicity

4.4 Ideal epoxy in underfill process

4.5 Defect analysis

4.Underfill Epoxy

VoidEpoxy Fatigue

Island EpoxyExcess Epoxy

Poor Epoxy

Function defect

Void

Epoxy Fatigue

Visual defect

Island epoxy

Excess epoxy

Poor epoxy

Others

4.5 Defect analysis

4.Underfill Epoxy

VoidVolatile void Capture void

General cause&solution in process

Substrate temperature is not matched for underfill

---- >> Refer to epoxy’s datasheet and select proper temperature

Dispense pattern is not suitable for die shape

---- >> Optimize underfill pattern

Dispense volume is not enough

---- >> Dispensing with sufficient epoxy volume

Viscosity of underfill epoxy is high

---- >> Use fresh underfill epoxy

4.5 Defect analysis

4.Underfill Epoxy

Volatile void

Underfill Curing

Cause & solution

Absorb moisture of FPC

-- >> Dispensing duly after reflow

Poor wetting parts on substrate by flux residue exists

-- >> Reduce flux residue

Moisture absorption changed profile

4.5 Defect analysis

4.Underfill Epoxy

Volatile void

4.5 Defect analysis

4.Underfill Epoxy

Capture void

The flow speed > The penetrate speed >>> Capture void

Cause & solution

Dispense pattern is not suitable for bump layout

-- >> Select proper dispense pattern

Die size is too big

-- >> Optimize dispense method and select proper epoxy

4.5 Defect analysis

4.Underfill Epoxy

Capture void

Underfill time too short in seal pass

Cause & solution

Underfill time too short

-- >> Waiting for epoxy penetrate the whole chip then do seal pass

Seal passDispensing

4.5 Relative test

4.Underfill Epoxy

C-SAM (SAM=Scaning acoustic microscopy)

Cross section

C-SAM is a test method which use ultrasonic scan to establish solder layer, underfill

layer is integrated or not.

Reflection of the ultrasonic beam at interfaces with impedance mismatch,,f.e. surface,

back wall,defects,layer interfaces…

Transverse section test, skive the sample to a surface (to void layer or filler delamination

layer and so on) and will get a view at the layer you want.

6.Flip Chip Applied Component

Microprocessor

Memory

25mmX25mm (Biggest)

Hard Disk Driver3mmX3mm